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Fig. 3 | BioMedical Engineering OnLine

Fig. 3

From: A high-density microelectrode-tissue-microelectrode sandwich platform for application of retinal circuit study

Fig. 3

The fabrication process of perforated MEA: a substrate with release layer deposited; b first polyimide spin coating; c polyimide patterning and curing; d Metal layer (Au and Ti) deposition and patterning; e second polyimide coating, patterning and curing; f Au and Pt black electroplating; g physically detach the device from the substrate. Arrows indicate the diffusion holes

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