Fig. 3From: A high-density microelectrode-tissue-microelectrode sandwich platform for application of retinal circuit studyThe fabrication process of perforated MEA: a substrate with release layer deposited; b first polyimide spin coating; c polyimide patterning and curing; d Metal layer (Au and Ti) deposition and patterning; e second polyimide coating, patterning and curing; f Au and Pt black electroplating; g physically detach the device from the substrate. Arrows indicate the diffusion holesBack to article page